Electronics contract manufacturing is based on original assembly
lines for SMD components surface mounting and selective soldering.
The mixed method significantly enhances the PCB assembly process
quality, rate, accuracy, flexibility and versatility, and ensures
execution of the project in compliance with requirements and in due
time.
The company provides the following
services:
- Assembly of products ranging from prototypes and small lots to
series-produced printed circuit boards;
- Assembly of components (SMD components sized from 0.6 х 0.3
mm2 (0201) to 55 х 55 mm2 with 0.3 mm lead
pitch, BGA components, mBGA, Flip-Chips, CSP);
- Assembly of components (SIP, DIP components in output cases,
components with axial and radial leads, non-standard and
large-sized components and connectors).
Assembly of SMD components is carried out through
the automated surface mounting
line (SMT). We can provide both one-sided and two-sided
printed circuit board assembly. Our equipment is appropriate for
processing the conventional printed circuit boards made of
fabric-based laminate, the flexible boards and the aluminum and
copper boards.
Automated assembly of BGA, mBGA, Flip-Chips, CSP and other
complex components is performed with the use of special headers and
well-tried techniques. Full reproducibility of the soldering
procedure is strictly observed, ensuring a high level of assembling
process quality in compliance with all required manufacturing
parameters.
EleSy is specialized in assembling SIP, DIP components in output
cases, components with axial and radial leads, non-standard and
large-sized components and connectors. THT assembly of printed
circuit boards is carried out through the automated
selective soldering line. High precision monitoring and
control of soldering parameters, absence of a human factor and
state-of-the-art technologies ensure maximum efficiency,
consistency of operation and eliminate occurrence of any
defects.